![]() Ltd. Shin Etsu Chemical Co., Ltd: silicon wafers, advanced photoresists, photomask blanks, and thermal conductive materials.Ltd.: wafer cleaning and anneal equipment and services for semiconductor manufacturing The PEER Group Inc.: automation software and services.Murata Machinery Ltd.: automated material handling systems, hoist vehicles and stockers.ModusLink Global Solutions Inc.: channel box CPU for Penang, Shanghai and Miami, and finished goods warehouse distribution for Miami.Mitsubishi Gas Chemical Company Inc.: high-purity peroxide and custom back-end cleans.Lam Research Corporation: fab capital equipment.KLA-Tencor Corporation: process control and yield management solutions.A Activities 122124 Amazon horned frogs 3637, 37, 118 Amazon. Hitachi Kokusai Electric Inc.: batch processing and single wafer processing systems Tape it to the back of the plate so it doesn't come loose. ![]() ![]() Hitachi High-Technologies Corporation: dry etching, ashing, metrology and advanced packaging systems.Fujimi Corporation: chemical mechanical planarization and silicon polishing slurries.Edwards Vacuum LLC: vacuum system products and abatement solutions.EBARA Corporation: chemical mechanical polishers, plating systems, and dry vacuum pumps and abatement systems.DISCO Corporation: precision cutting, grinding and polishing machines.Daifuku: automated material handling systems.Ltd.: plastic injection molded tray media for bare die automation, substrate transport, device assembly and test, final shipping and storage, bare die tape and reel media for bare die transport Daewon Semiconductor Packaging Industrial Co.ASM International: front-end equipment supplier for atomic layer deposit, plasma-enhanced ALD, metal gate and diffusion.Amkor Technology Inc.: semiconductor advanced packaging design, assembly and test services.This list from Intel demonstrates the potential companies and types of industries that could be coming: Intel Ohio General Manager Jim Evers speaks with reporters.
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